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IPU (New Scheme 2026 onward) · IT · Semester 1

PCB Design

ICT-117

Multidisciplinary

This is the multidisciplinary course, and your department offers one paper of it: PCB Design (ICT-117, from Electronics and Communication Engineering) or Introduction to Manufacturing Process (ICT-119, from Mechanical and Automation Engineering). Your institute may instead offer any other three-credit paper from another school.

Syllabus1

Syllabus — PCB Design (ICT-117)

Official GGSIPU syllabus for the B.Tech 2026-30 batch (first year, under USICT), applicable from the academic session 2026-27.

L 3 C 3

Teachers Continuous Evaluation: 40 marks. Term-End Semester Examination: 60 marks.

Course outcomes

  • Understand and Design PCB
  • Understand Component placement strategies and layout validation
  • Understand PCB fabrication steps
  • Design simple Single - layer and double - layer PCBs

Unit I

PCB types (single-layer, double-layer, multilayer), through-hole vs. SMD components, PCB materials and substrates, structure of a PCB (pads, vias, traces, silkscreen, solder mask), design workflow overview, schematic capture, netlists, introduction to EDA tools (KiCAD, Eagle, Altium Designer), library creation and part symbols.

Unit II

Component placement strategies, design for manufacturability (DFM), trace width and spacing calculation, ground and power planes, decoupling and bypass capacitors, differential pair routing, impedance matching basics, EMI/EMC guidelines, schematic to layout process, netlist management, layout validation (DRC, ERC), use of design constraints.

Unit III

PCB fabrication steps (photoresist, etching, plating, solder mask), via types (through-hole, blind, buried), panelization, surface finish types (HASL, ENIG), soldering methods (wave, reflow, hand soldering), SMD rework tools, bill of materials (BoM), Gerber file generation, pick-and-place file, understanding fabrication drawings.

Unit IV

Design of simple single-layer and double-layer PCBs: •Power supply board (linear and switching) •Microcontroller breakout board •Sensor interface (e.g., temperature or motion) •LED driver circuit Signal integrity simulation basics, thermal considerations, component derating, PCB testing and debugging, integration with embedded systems.

Textbooks

  • Printed Circuit Board Design using KiCad, Peter Dalmaris, Tech Explorations, Latest Edition.
  • Complete PCB Design Using OrCAD Capture and PCB Editor, Kraig Mitzner, Newnes (Elsevier).

References

  • PCB Design for Real-World Design, Chris Schroeder, Prentice Hall.Latest Edition
  • High-Speed Digital Design: A Handbook of Black Magic, Howard Johnson & Martin Graham, Prentice Hall.Latest Edition
  • Signal and Power Integrity –Simplified, Eric Bogatin, Pearson.Latest Edition
  • Texas Instruments and Analog Devices App Notes on PCB Layout.Latest Edition
  • IPC Standards (IPC-2221, IPC-7351, IPC-A-600) –for layout, land patterns, and acceptability.
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